PHASE 01
Launch Readiness & Quality Foundation
Establish the core infrastructure, quality systems and process frameworks to ensure consistent, reliable and world-class testing outputs.
Objectives
Laboratory infrastructure setup
QMS implementation
SOP development
Team onboarding
Customer qualification framework
Key Deliverables
ISO 9001-aligned processes
ERP/LIMS readiness
Initial customer onboarding
Calibration ecosystem
VALUE TO OUR CUSTOMERS
Strong quality foundation ensures reliable, consistent and globally benchmarked testing from day one.
PHASE 02Environmental & Accelerated Reliability Lab
Create accelerated stress testing capability to validate semiconductor durability under harsh thermal, humidity and operating conditions.
Equipment
High-Accelerated Stress Test (HAST) ChamberThermal Shock Chamber (Dual-Zone / Air-to-Air)HTOL / Burn-In Oven (Modular)
Customer Benefits
Faster qualification cyclesReliability predictionJEDEC compliance support
VALUE TO OUR CUSTOMERSAccelerated reliability testing helps customers qualify products faster and reduce long-term field risk.
PHASE 03Mechanical & Package Integrity Lab
Validate package robustness, transport survivability and mechanical integrity under realistic operating and logistics conditions.
Equipment
Industrial Electrodynamic Vibration Test SystemMechanical Shock Test SystemDrop Test Capability
Customer Benefits
Transport robustness validationPackage integrity assuranceMission-profile simulation
VALUE TO OUR CUSTOMERSMechanical validation strengthens confidence in package durability across transport, installation and mission conditions.
PHASE 04Assembly & Interconnect Validation Lab
Support packaging process validation by verifying bond quality, solder joint integrity and interconnect reliability.
Equipment
Automated Bond Tester (Pull & Shear)Die Shear CapabilitySolder Joint Inspection Systems
Customer Benefits
Packaging process optimizationInterconnect reliability verificationReduced field failures
VALUE TO OUR CUSTOMERSInterconnect validation improves assembly quality, strengthens packaging reliability and reduces avoidable failure risks.
PHASE 05Failure Analysis & Non-Destructive Inspection Lab
Enable structured root-cause analysis, non-destructive inspection and metrology support for quality improvement.
Equipment
Scanning Acoustic Microscope (SAM / C-SAM)High-Resolution Digital Metrology Microscope with 3D Profiling
Future Expansion
X-ray InspectionDecapsulation CapabilityCross-Section Analysis
Customer Benefits
Faster root-cause identificationYield improvementLower warranty costs
VALUE TO OUR CUSTOMERSFailure analysis capability accelerates problem solving, reduces repeat defects and supports yield improvement programs.
PHASE 06Electrical Characterization & Bench Validation Lab
Build bench-level electrical characterization capability for parametric validation, device evaluation and design verification.
Equipment
High-Precision Semiconductor Parameter Analyzer
Future Expansion
Source Measure Units (SMUs)OscilloscopesPower Analyzers
Customer Benefits
Device characterizationParametric validationFaster design verification
VALUE TO OUR CUSTOMERSElectrical bench validation helps customers measure, characterize and validate device performance with confidence.
PHASE 07Advanced Lab Expansion & Accreditation Scale-Up
Scale OSSTPL into a broader accreditation-ready semiconductor testing platform with advanced analytical depth.
Strategic Goals
NABL AccreditationAutomotive qualification supportAerospace-grade validationAdvanced FA capabilitiesAI-driven analyticsDigital twin infrastructure
Customer Benefits
Single-window testing platformGlobal benchmarkingHigher confidence for exports
VALUE TO OUR CUSTOMERSAdvanced expansion creates a globally benchmarked, accreditation-ready platform for long-term semiconductor ecosystem support.
